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📐 - Designing / 📦-cob / gf180mcu-project-template/librelane/conf...
Between 2025-09-30 11:59 p.m. and 2025-11-01 12:00 a.m.
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Leo Moser (mole99) 2025-10-27 7:30 a.m.
7:30 a.m.
The mapping happens in the config.yaml through the PAD_SOUTH, PAD_EAST, PAD_NORTH and PAD_WEST variables. However, chip_top.sv also needs to be changed to instantiate more or fewer pads. You could do a 50pin mezzanine using the same 74pad padring. Simply ignore the pads that shouldn't be used. If you adjust the padring, we need to pay a second bonding setup fee. And, as you mentioned, we need more files in the template, which could confuse people. A new bonding setup would probably only make sense if we have a new die size.
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Leo Moser (mole99)
The mapping happens in the config.yaml through the PAD_SOUTH, PAD_EAST, PAD_NORTH and PAD_WEST variables. However, chip_top.sv also needs to be changed to instantiate more or fewer pads. You could do a 50pin mezzanine using the same 74pad padring. Simply ignore the pads that shouldn't be used. If you adjust the padring, we need to pay a second bonding setup fee. And, as you mentioned, we need more files in the template, which could confuse people. A new bonding setup would probably only make sense if we have a new die size.
Andrew Wingate 2025-10-27 7:51 a.m.
Thank you! That's what I basically figured. This also kindof works the best because the wirebonding frame and everything else can remain the same/very similar.
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